TEC1-12706 Semiconductor Refrigeration Tablets 40x40MM 12V 5.8A Heatsink Thermoelectric Cooler for Cooling for Power Generation
Feature:
1. Whisper-Quiet and Solid-State Cooling: Experience the benefits of a cooling solution with no moving parts, ensuring a noise-free operation. Our semiconductor refrigeration tablet provides reliable and solid-state cooling performance.
2. Compact Design, Lightweight: With its compact size and lightweight construction, our heatsink thermoelectric cooler offers easy integration and installation in various applications. Save space without compromising on cooling efficiency.
3. Environmentally Friendly Cooling Solution: Embrace an eco-friendly approach to cooling with our peltier elemente module. It operates without harmful refrigerants or emissions, making it an environmentally conscious choice.
4. Precise Temperature Control: Achieve precise temperature control with our thermoelectric cooler peltier. Maintain optimal cooling conditions for your devices, ensuring efficient operation and prolonging their lifespan.
5. Reliable Quality, Outstanding Performance: Trust in the reliability and exceptional performance of cooling peltier plate module. Built with high-quality materials and advanced technology, it delivers consistent and efficient cooling results that meet your needs.
Specification:
Origin: Mainland China
Type: Module
Condition: New
Model Number: Integrated Circuits
Chip Model: TEC1-12706
Dimensions: 40403.8mm, 127 couples of elements
Wire Specifications: Lead length of approximately 300±5mm, RV standard wire with a single 5mm tinned head
Internal Resistance: 2.12.52 (tested at environmental temperature of 23±1℃, using 1kHz AC)
Maximum Temperature Difference: Tmax(Qc-0) above 60℃
Operating Current: Imax=5.8A (approximately 4.5A based on 12V constant voltage and heat dissipation capability)
Rated Voltage: DC12V (Vmax: 15V, starting current 5.8A)
Cooling Power: Qcmax 58-65W
Mounting Pressure: 85N/cm2
Operating Environment: Temperature range -55℃ to 83℃ (excessively high ambient temperatures directly affect cooling efficiency)
Encapsulation Process: Standard 704 silicone rubber sealing around the edges
Packaging Standard: Foam box packaging, storage conditions with environmental temperature of -
Storage Conditions: -40℃ to 60℃
Application Areas:
Food and beverage service refrigerators
Portable car cooling boxes
Liquid cooling systems
Temperature stabilizers
CPU coolers and scientific instruments
Photonics and medical systems
Usage:
How to achieve cooling?
1. Prepare the following components: cooling plate, heat sink, thermal grease, insulation pad, and power supply.
2. Apply thermal grease to the cooling and heating surfaces of the cooling plate.
3. Install the cooling plate onto the heat sink, placing an insulation pad in between.
4. Tighten the screws, apply power, and start cooling.
Note:
1. Cooling plate operates with one side cooling and the other side heating, ensuring efficient heat dissipation from the heating surface during operation.
2. Strictly avoid powering the device for more than 2 seconds without proper heat dissipation to prevent overheating and potential damage. Buyers assume responsibility for any damages caused by improper usage.
3. It is essential to apply thermal grease when installing the cooling plate onto a heat sink.
4. The side with markings is the cold surface, while the unmarked side is the hot surface.
5. Proper installation of a heat sink or water cooling device on the heat-absorbing surface is necessary to prevent damage.
6. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!
7. Please allow 1-2cm measuring deviation due to manual measurement.
